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Packages
Plastic, Air cavity, thermal, sensor, optical, ceramic, MCM, MEMS, BGA, CSP, high pin count, power, custom... |
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Leadframes
Stamped, etched, custom, premoulded, select plated |
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Substrates
High tech subtrate systems, LTCC developments |
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Molded lens
Lens units, lids, covers and holders... |
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